5 projets européens trouvés
Recherche sur 125080 projets européens
TERMINÉ
Industry 4.0 for wood and furniture manufacturers
Date du début: 1 nov. 2016, Date de fin: 31 oct. 2019,
The EU supports the 4th industrial revolution through its industrial policy and through research and infrastructure funding. However, challenges like training workers and future professionals remain. Furthermore the furniture and wood sector has identified that it has a shortage of professionals with high qualification in ICTs and other emerging technologies. Some of the specific skills and compe ...
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13
Participants partenaires
TERMINÉ
Biobased self-functionalised self-reinforced composite materials based on high performance nanofibrillar PLA fibres (BIO4SELF)
Date du début: 1 mars 2016, Date de fin: 30 juin 2019,
...ness and high Tm one to form the reinforcing fibres. To reach unprecedented stiffness in the reinforcing PLA fibres, we will combine PLA with bio-LCP (liquid crystalline polymer) for nanofibril formation. Further, we will increase the temperature resistance of PLA and improve its durability. This way, BIO4SELF will exploit recent progress in PLA fibre technology. We will add inherent self-function ...
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16
Participants partenaires
TERMINÉ
European 450mm Equipment Demo Line (E450EDL)
Date du début: 1 oct. 2013, Date de fin: 30 sept. 2016,
The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative and proceeded with subsequent projects funded with public money, amongst others NGC450, SOI450, EEM450PR. The demo line resulting from this project will be such that it will enable first crit ...
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44
Participants partenaires
TERMINÉ
European 450mm Equipment & Materials Initiative (EEMI 450)
Date du début: 1 avr. 2010, Date de fin: 1 mars 2013,
Large-scale semiconductor fabrication is now standardised on 300mm diameter wafers. However, as demand grows and node dimensions diminish, major chipmakers are considering offsetting the growing costs of miniaturisation by increasing wafer size to 450mm to cut cost per produced die. A prerequisite is the availability of the required quality wafers and equipment able to handle larger wafers. The EN ...
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27
Participants partenaires
TERMINÉ
Novel Intruder Detection & Authentication Optical Sensing Technology (iDetecT 4ALL)
Date du début: 1 juil. 2008, Date de fin: 30 juin 2011,
iDetecT 4ALL addresses the urgent need for alerting technology for surveillance and intruders detection inside and in the surrounding of Critical Infrastructures (CI). The limited sensing capabilities as well as the very high cost of existing security equipment impose a barrier to implement necessary security means for ALL CIs with restricted areas including those having budget constrains. IDetecT ...
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