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Interconnection technologies for flexible systems (Interflex)
Date du début: 1 janv. 2010, Date de fin: 30 nov. 2013,
...ean industrial giants Bosch and ST Microelectronics who combine their expertise on packaging and flexible foil systems. Their expertise in complemented by Henkel Belgium in the materials field and by Infotech in the automation field, as well as leading applied research organisations CEA and Fraunhofer with background in flexible components and systems.
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