2 projets européens trouvés
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TERMINÉ
Silicon-based Ultra-Compact Cost-Efficient System Design for mm-Wave Sensors (SUCCESS)
Date du début: 1 déc. 2009, Date de fin: 31 mai 2013,
SUCCESS targets to develop a technology platform and best-practice design methods to enable the breakthrough of silicon mm-Wave SoCs for high-volume applications. Silicon technology (CMOS, SiGe) has made tremendous progress towards ever higher device cut-off frequencies. Nowadays all RF components for mm-Wave sensing applications up to 120 GHz can be realized in silicon. Silicon technology hence ...
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TERMINÉ
Thin Interconnected Package Stacks (TIPS)
Date du début: 8 sept. 2008, Date de fin: 7 mars 2012,
The project TIPS aims at the conflation of embedding technologies for electronic components into extremely thin packages and the interconnection of those packages into stacked electronic systems. The testing of individual packages before stacking is performed will mitigate stacked package yield issues.Embedding of components will be developed starting from a basis of different technical approaches ...
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