4 projets européens trouvés
Recherche sur 125080 projets européens
TERMINÉ
Arrowhead (ARROWHEAD)
Date du début: 1 mars 2013, Date de fin: 28 févr. 2017,
"Our society is facing both energy and competitiveness challenges. These challenges are tightly linked and require new dynamic interactions between energy producers and energy consumers, between machines, between systems, between people and systems, etc. Cooperative automation is the key for these dynamic interactions and is enabled by the technology developed around the Internet of Things and Ser ...
Voir le projet
87
Participants partenaires
TERMINÉ
Developing a novel light-weight Ready Mixed Concrete (ReMix)
Date du début: 1 mars 2015, Date de fin: 31 août 2015,
Ordinary ready-mixed concrete is made of sand, cement, water, stone gravel and additives. Albeit aggregate gravel is chosen for its high compressive strength and relatively low cost, its use is associated with different problems. Due to its high density, any construction will require more steel reinforcement to support the weight of the heavy concrete. The different sizes and shapes as well as the ...
Voir le projet
2
Participants partenaires
TERMINÉ
"A novel, integrated, wheelchair and hoist system" (HOMEHOIST)
Date du début: 1 janv. 2013, Date de fin: 31 déc. 2014,
"The objective of the project is to produce a wheelchair with an integral hoist system. This will allow for more independent living, a reduced need for lifting and manual handling from carers and a reduction in the number of costly disability aids within the home.The Homehoist system will function initially as an everyday wheelchair, but will also be capable of lifting the user at certain positio ...
Voir le projet
6
Participants partenaires
TERMINÉ
European 450mm Equipment & Materials Initiative (EEMI 450)
Date du début: 1 avr. 2010, Date de fin: 1 mars 2013,
Large-scale semiconductor fabrication is now standardised on 300mm diameter wafers. However, as demand grows and node dimensions diminish, major chipmakers are considering offsetting the growing costs of miniaturisation by increasing wafer size to 450mm to cut cost per produced die. A prerequisite is the availability of the required quality wafers and equipment able to handle larger wafers. The EN ...
Voir le projet