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Universal Failsafe IGBT Package for robust power transmission (UniPack)
Date du début: 1 déc. 2011, Date de fin: 30 nov. 2013,
Through a mixture of applied research and development, the Uni-Pack project will deliver technologies to reduce the manufacturing costs and improve the performance of plastic packaged IGBT (Insulated gate bipolar transistor) modules, in particular those for use in Voltage Source Converters (VSC) for High Voltage Direct Current (HVDC) power transmission. VSC technology enables efficient access to r ...
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