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6 projets européens trouvés

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 TERMINÉ 

CarbON Nanotube compositE InterconneCTs (CONNECT)

Date du début: 1 janv. 2016, Date de fin: 31 déc. 2018,

Our modern society has gained enormously from novel miniaturized microelectronic products with enhanced functionality at ever decreasing cost. However, as size goes down, interconnects become major bottlenecks irrespective of the application domain. CONNECT proposes innovations in novel interconnect architectures to enable future CMOS scaling by integration of metal-doped or metal-filled Carbon Na ...
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 7

 TERMINÉ 
Among the physical limitations which challenge progress in nanoelectronics for aggressively scaled More Moore, process variability is getting ever more critical. Effects from various sources of process variations, both systematic and stochastic, influence each other and lead to variations of the electrical, thermal and mechanical behavior of devices, interconnects and circuits. Correlations are of ...
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 5

 TERMINÉ 
REMINDER aims to develop an embedded DRAM solution optimized for ultra-low-power consumption and variability immunity, specifically focused on Internet of Things cut-edge devices. The objectives of REMINDER are :i) Investigation (concept, design, characterization, simulation, modelling), selection and optimization of a Floating-Body memory bit cell in terms of low power and low voltage, high relia ...
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 9

 TERMINÉ 
The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (FDSOI) so as to compete in leading edge technology at node 14nm and beyond preparing as well the following node transistor architecture. Europe is at the root of this breakthrough technology in More Moore law. The project aims at establishing a distributed pilo ...
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 32

 TERMINÉ 
Description Among the physical limitations which challenge progress in nanoelectronics for aggressively scaled More Moore, Beyond CMOS and advanced More-than-Moore applications, process variability and the interactions between and with electrical, thermal and mechanical effects are getting more and more critical. Effects from various sources ...
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 9

 TERMINÉ 
"In this project we will develop multiscale modelling technology supported by comprehensive experimental characterization techniques to study the degradation and reliability of next generation Complimentary-Metal-Oxide-Semiconductor (CMOS) devices. Building upon fundamental analysis of the structure and electronic properties of relevant materials and interfaces at the quantum mechanical level, we ...
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 9