2 projets européens trouvés
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TERMINÉ
Photonic Integrated Circuits Assembly and Packaging Pilot Line (PIXAPP)
Date du début: 1 janv. 2017, Date de fin: 31 déc. 2020,
PIXAPP will establish the world’s first open access Photonic Integrated Circuit (PIC) assembly & packaging Pilot Line. It combines a highly-interdisciplinary team of Europe’s leading industrial & research organisations. PIXAPP provides Europe’s SMEs with a unique one-stop-shop, enabling them to exploit the breakthrough advantages of PIC technologies. PIXAPP bridges the ‘valley of death’, providing ...
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TERMINÉ
Photonic Hybrid ASsembly Through FLEXible waveguides (PHASTFlex)
Date du début: 1 janv. 2014, Date de fin: 31 déc. 2016,
PHASTFLEX proposes the development of a fully automated, high precision, cost-effective assembly technology for next generation hybrid photonic packages. In hybrid packages, multiple Photonic ICs (PICs) are assembled, combining the best of different material platforms for a wide range of applications and performance. In PHASTFlex, InP PICs with active functions are combined with passive TriPleX PI ...
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