3 projets européens trouvés
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TERMINÉ
Photonic Integrated Circuits Assembly and Packaging Pilot Line (PIXAPP)
Date du début: 1 janv. 2017, Date de fin: 31 déc. 2020,
PIXAPP will establish the world’s first open access Photonic Integrated Circuit (PIC) assembly & packaging Pilot Line. It combines a highly-interdisciplinary team of Europe’s leading industrial & research organisations. PIXAPP provides Europe’s SMEs with a unique one-stop-shop, enabling them to exploit the breakthrough advantages of PIC technologies. PIXAPP bridges the ‘valley of death’, providing ...
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20
Participants partenaires
TERMINÉ
Photonic Hybrid ASsembly Through FLEXible waveguides (PHASTFlex)
Date du début: 1 janv. 2014, Date de fin: 31 déc. 2016,
PHASTFLEX proposes the development of a fully automated, high precision, cost-effective assembly technology for next generation hybrid photonic packages. In hybrid packages, multiple Photonic ICs (PICs) are assembled, combining the best of different material platforms for a wide range of applications and performance. In PHASTFlex, InP PICs with active functions are combined with passive TriPleX PI ...
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10
Participants partenaires
TERMINÉ
GIGA BIT ACCESS PASSIVE OPTICAL NETWORK USING WAVELENGTH DIVISION MULTIPLEXING (GigaWaM)
Date du début: 1 avr. 2008, Date de fin: 30 sept. 2012,
The need for higher speed is a never ceasing requirement for broadband access and requirement of 1 Gbps is expected around 2016. The copper lines are expected to reach their maximum capacity at about 10 Mbps while the capacity required only for watching one channel of HDTV is 20 Mbps.Tithe total number of homes connected to fibres will grow from about 11 million at the end of 2006 to about 86 mill ...
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