The objective of this proposal is to develop and demonstrate a scalable, thermally-enabled 3D integrated optoelectronic platform that can meet the explosion in data traffic growth within ICT. The Thermally Integrated Smart Photonics Systems (TIPS) program will heterogeneously integrate micro-thermoelectric coolers (μTEC) and micro-fluidics (μFluidics) with optoelectronic devices (lasers, modulator ...