3 projets européens trouvés
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TERMINÉ
Modular interposer architecture providing scalable heat removal, power delivery, and communication (CarrICool)
Date du début: 1 janv. 2014, Date de fin: 31 déc. 2016,
Modular interposer architecture providing scalable heat removal, power delivery and communicationCarrICool will deliver a game-changing 3D packaging platform for scale-up of future, many-core, Exascale computing systems. The project will also develop a strategic supplier base in Europe for high-end HPC components and systems integration capabilities in the Exascale era. In CarrICool, advanced More ...
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9
Participants partenaires
TERMINÉ
Innovative Nano and Micro Technologies for Advanced Thermo and Mechanical Interfaces (NANOTHERM)
Date du début: 1 sept. 2012, Date de fin: 29 févr. 2016,
Future electronic power devices and packages will need to demonstrate more performance and functionality at reduced cost, size, weight, energy consumption and thermal budget. Further, increasing reliability demands have also to be met by industry to be competitive in this growing multi-billion Euro market of heterogeneously integrated systems.To respond to these challenges, new innovative nano- an ...
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18
Participants partenaires
TERMINÉ
Functional joining of dissimilar materials using directed self-assembly of nanoparticles by capillary-bridging (HYPERCONNECT)
Date du début: 1 janv. 2013, Date de fin: 31 déc. 2015,
Tomorrows micro-electronic devices will have to show more functionality and performance at smaller form factor, lower cost and lower energy consumption in order to be competitive on this multi-billion dollar market. Advanced system integration is thus inevitable, a trend bound to joining dissimilar materials with new packaging technologies. These processes must enable lower thermal resistances and ...
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