8 projets européens trouvés
Recherche sur 125080 projets européens
TERMINÉ
Pilot line production of functionalized CNTs as thermal interface material for heat dissipation in electronics applications (SMARTHERM)
Date du début: 1 janv. 2016, Date de fin: 31 déc. 2018,
The global economy is benefiting from the fast evolution of the semiconductor industry. The primary driving force of the semiconductor industry is the increasing integration density, which has lead not only to higher transistor density but also to increasing power density. Power density is expected to increase up to 135 W/cm2 in 2024 for single chip packages. This puts significant stress on therma ...
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5
Participants partenaires
TERMINÉ
QUANTItative scanning probe microscopy techniques for HEAT transfer management in nanomaterials and nanodevices (QUANTIHEAT)
Date du début: 1 déc. 2013, Date de fin: 30 nov. 2017,
The thermal properties of nanostructured materials are of fundamental importance to modern technology, but at present reproducible metrological definitions, tools and methods do not exist. This is because the mechanisms of heat transport at the nanoscale are entirely different to those at the macro scale.The project will place nanothermal metrology on a solid basis by an integrated physics-based e ...
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23
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TERMINÉ
Pre-standardisation of incremental FIB micro-milling for intrinsic stress evaluation at the sub-micron scale (ISTRESS)
Date du début: 1 janv. 2014, Date de fin: 31 déc. 2016,
"Intrinsic (or residual) stresses, resulting from manufacturing or processing steps, mostly define the performance and limit the lifetime of nanostructured materials, thin films, coatings and MEMS devices.The established techniques for micron-scale measurement of residual stress still have strong limitations, e.g. in terms of spatial resolution, lack of depth sensing, their applicability on non-cr ...
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16
Participants partenaires
TERMINÉ
Innovative Nano and Micro Technologies for Advanced Thermo and Mechanical Interfaces (NANOTHERM)
Date du début: 1 sept. 2012, Date de fin: 29 févr. 2016,
Future electronic power devices and packages will need to demonstrate more performance and functionality at reduced cost, size, weight, energy consumption and thermal budget. Further, increasing reliability demands have also to be met by industry to be competitive in this growing multi-billion Euro market of heterogeneously integrated systems.To respond to these challenges, new innovative nano- an ...
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18
Participants partenaires
TERMINÉ
Smart integration of GaN & SiC high power electronics for industrial and RF applications (SMARTPOWER)
Date du début: 1 sept. 2011, Date de fin: 31 janv. 2016,
Description
Packaging and thermal management in an efficient and cost effective way for SiC and GaN-based power devicesFor industrial motor-drive, UPS and solar inverters applications and aerospace or telecom radio frequency applications, new emerging power semiconductor technologies, respectively SiC and GaN, have demonstrated their high ...
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15
Participants partenaires
TERMINÉ
Smart and Compact Battery Management System Module \nfor Integration into Lithium-Ion Cell for Fully Electric Vehicles (Smart-LIC)
Date du début: 1 mai 2011, Date de fin: 31 oct. 2014,
Smart & Compact Battery Management System Module for Integration into Lithium-Ion Cell for Fully Electric VehiclesSMART-LIC addresses the development of a new Battery Management System concept aiming at:* Higher efficiency of the battery packs because of the localized control* Increased overall reliability and safety such that early determination of irregularities and failures of the actual batter ...
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11
Participants partenaires
TERMINÉ
Fatigue testing of CFRP materials (FATIMA)
Date du début: 1 janv. 2011, Date de fin: 31 déc. 2013,
"The FATIMA project proposed by the consortium will work on testing and fatigue prediction of carbon fiber reinforced plastics (CFRP) as required in call JTI-CS-2010-3-ECO-01-007. The challenging objective is to go beyond the state of the art in terms of approaches to account for humidity, multi-ply and multi-axiality effects in organic laminate structures. Intensive work in the field resulted in ...
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3
Participants partenaires
TERMINÉ
Nano Packaging Technology for Interconnect and Heat Dissipation (NANOPACK)
Date du début: 1 nov. 2007, Date de fin: 30 sept. 2011,
One of the major limitations to continued performance increases in the semiconductor and power electronics industries is integration density and thermal management. Continued transistor downscaling is quickly reaching its limits forcing a new focus on heterogeneous integration and 3D packaging technologies to continue performance improvements by reducing interconnect length between memory and mult ...
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