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Investigation of Si wafer damage in manufacturing processes (SIDAM)
Date du début: 1 janv. 2008, Date de fin: 30 juin 2011,
...valuation of risk of breakage during their processes. They will have a choice of access to off-line characterization of defects by XRDI at ANKA or an in-line wafer inspection tool commercialized by Bede plc. The knowledge and tools developed will contribute to maintaining Europe's leading position in semiconductor x-ray metrology.
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