3 projets européens trouvés
Recherche sur 125080 projets européens
TERMINÉ
Advanced Surface Protection for Improved Reliability PCB Systems (ASPIS)
Date du début: 1 oct. 2010, Date de fin: 30 sept. 2013,
"To investigate the scope, extent and factors causing black pad and related problems on printed circuit boards with an electroless nickel / immersion gold (ENIG) solderable finish . To develop a non-destructive test method to show the presence of black pad. To develop and test lower cost, less aggressive surface protection chemistries as replacements for conventional ENIG using both aqueous and io ...
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11
Participants partenaires
TERMINÉ
Joint Equipment and Materials for System-in-Package and 3D-Integration (JEMSIP_3D)
Date du début: 1 avr. 2009, Date de fin: 1 mars 2012,
The objective of the project « Joint Equipment & Materials for System-in-Package and 3D Integration » is to validate technological solutions for the fabrication of high value-added heterogeneous components and systems.This theme, generally known as “More Than Moore”, intends to gather within a unique system a set of various functions, implemented with elementary components, those generally being f ...
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20
Participants partenaires
TERMINÉ
High density integration by embedding chips for reduced size modules and electronic systems (HERMES)
Date du début: 1 mai 2008, Date de fin: 29 févr. 2012,
The proposed HERMES project wants to initiate a new mainstream packaging concept not bound by the existing supply chain, and by large-scale manufacturing technology. The project is aiming at further developing the concept of embedded thin chips into electronic boards, as a base for an integrated manufacturing of electronic circuits.The project consortium will develop a technology for embedding act ...
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