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Efficient and Precise 3D Integration of Heterogeneous Microsystems from Fabrication to Assembly (FAB2ASM)
Date du début: 1 mai 2010, Date de fin: 30 avr. 2013,
FAB2ASM tackles a major problem in 3D integration that currently limits industrial take-up: high throughput and high accuracy 3D integration of miniaturized dies onto dies or substrates. This issue is extremely important for 3D integration of microelectronics and microsystems. 3D integration will take off in the next 5 years in all measures including total number of devices, the market share, as w ...
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