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3D Advanced Metrology and materials for advanced devices (3DAM)
Date du début: 1 avr. 2016, Date de fin: 31 mars 2019,
The objective of the 3DAM project is to develop a new generation of metrology and characterization tools and methodologies enabling the development of the next semiconductor technology nodes. As nano-electronics technology is moving beyond the boundaries of (strained) silicon in planar or finFETs, new 3D device architectures and new materials bring major metrology and characterization challenges w ...
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