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High density integration by embedding chips for reduced size modules and electronic systems (HERMES)
Date du début: 1 mai 2008, Date de fin: 29 févr. 2012,
The proposed HERMES project wants to initiate a new mainstream packaging concept not bound by the existing supply chain, and by large-scale manufacturing technology. The project is aiming at further developing the concept of embedded thin chips into electronic boards, as a base for an integrated manufacturing of electronic circuits.The project consortium will develop a technology for embedding act ...
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