8 projets européens trouvés
Recherche sur 125080 projets européens
TERMINÉ
Technology Advances and Key Enablers for 5 nm (TAKE5)
Date du début: 1 avr. 2016, Date de fin: 31 mars 2019,
The TAKE5 project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm development for the 10nm technology node and the ECSEL JU project SeNaTe aiming at the 7nm technology node. The main objective of the TAKE5 project is the demonstration of 5nm patterning in line with the industry needs and the ITRS roadmap in the Advanced Patter ...
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13
Participants partenaires
TERMINÉ
Seven Nanometer Technology (SeNaTe)
Date du début: 1 avr. 2015, Date de fin: 31 mars 2018,
The SeNaTe project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm development for the 12nm and 10nm technology nodes. The main objective is the demonstration of the 7nm IC technology integration in line with the industry needs and the ITRS roadmap on real devices in the Advanced Patterning Center at imec using innovative devi ...
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41
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TERMINÉ
PANACHE
Date du début: 2 janv. 2014, Date de fin: 2 janv. 2018,
Pilot line for Advanced Nonvolatile memory technologies for Automotive microControllers, High security applications and general Electronics :The PANACHE project objective is to set-up a pilot line for embedded Flash technology design and manufacturing platform for the prototyping of innovative µcontrollers in Europe.The current 40nm technology platform as well as the already defined 55nm technolog ...
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21
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TERMINÉ
Coordination Action to enable an effective European 450 mm Equipment & Materials Network (ENABLE450)
Date du début: 1 nov. 2012, Date de fin: 31 oct. 2016,
5 major global semiconductor companies Intel, Samsung, TSMC, IBM and Global Foundries, have decided to work closely together to bring 450 mm semiconductor processing to a mature level, within a consortium called G450C. This operation, based in Albany N.Y., is currently ordering and installing the first wave of 450 mm systems. The major drivers of this effort are Intel and TSMC, which have provide ...
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13
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TERMINÉ
Semiconductor Equipment Assessment for Key Enabling Technologies (SEA4KET)
Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,
SEA4KET (Semiconductor Equipment Assessment for Key Enabling Technologies) is an IP proposal taking the consequent step from equipment R&D to equipment assessment experiments. The strategic objective is to effectively combine resources and expertise in a joint assessment of novel equipment for key enabling technologies to foster and accelerate the successful transfer of novel European equipment in ...
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26
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TERMINÉ
Support Action for 450mm topics establishing a Bridge between European EM entities and IDMs, Foundries and Entities Worldwide (Bridge450)
Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,
Five major global semiconductor companies are working in the G450C consortium based in Albany N.Y. to introduce 450mm wafer semiconductor processing and are now installing the first wave of 450mm prototype systems. Intel and TSMC lead this effort with published roadmaps showing pilot lines in 2016, production in 2018. Samsung will soon follow which will force GlobalFoundries, SK Hynix, Toshiba, UM ...
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12
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TERMINÉ
European 450mm Equipment Demo Line (E450EDL)
Date du début: 1 oct. 2013, Date de fin: 30 sept. 2016,
...package on lithography is to develop a wafer stage test-rig, which can be implemented into the pilot line system.In the work package on front end equipment several tools will be developed such as a plasma ion implant module, a plasma dry etch module, a RTP system and a single wafer cleaning system.Furthermore, in the dedicated work package on metrology 450mm metrology tool types will be developed ...
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44
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TERMINÉ
Gigascale Oriented Solid State flAsh Memory for EuRope (GOSSAMER)
Date du début: 1 janv. 2008, Date de fin: 30 juin 2011,
Description
GOSSAMER successfully developed a fully integrated Flash NAND technology based on the TANOS concept, investigating a large number of architecture and material options.
The project aimed at the development of the technology for very high density Non Volatile Memories for mass storage ap ...
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