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19 projets européens trouvés

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 TERMINÉ 

Highly Integrated Optoelectronic Sensor (HIOS)

Date du début: 1 août 2016, Date de fin: 31 juil. 2019,

...bient Light Sensor and derivate such as UV Sensor & Color Sensor. Three main markets which will be addressed are the Wearable, Low Cost Consumer (smart phones, cellular) & Smart Lighting Market.ams already offers prior art TSL2584TSV which is industry’s first ambient light sensor with 3D/TSV and single filter integrated at wafer level. In HIOS project the consortium wants to move one step further ...
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 4

 TERMINÉ 

Pervasive Ubiquitous Lightwave SEnsor (PULSe)

Date du début: 1 janv. 2017, Date de fin: 30 juin 2019,

PULSe's objective is to optimize, industrialize and create the conditions for a market exploitation of the first cost -effective Brillouin distributed sensing solution based on a synergy of innovations on interrogator equipment, strain sensing cable and open-access application support tools.
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 5

 TERMINÉ 

Flexible FE/BE Sensor Pilot Line for the Internet of Everything (IoSense)

Date du début: 1 mai 2016, Date de fin: 30 avr. 2019,

The EU has set the stage to empower semiconductor manufacturing in Europe being one of the key drivers for innovation and employment and creator for answers to the challenges of the modern society. Aim of IoSense is to boost the European competitiveness of ECS industries by increasing the pilot production capacity and improving Time-to-Market for innovative microelectronics, accomplished by establ ...
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 33

 TERMINÉ 

A generic CMOS-compatible platform for co-integrated plasmonics/photonics/electronics PICs towards volume manufacturing of low energy, small size and high performance photonic devices (PLASMOfab)

Date du début: 1 janv. 2016, Date de fin: 31 déc. 2018,

PLASMOfab aims to address the ever increasing needs for low energy, small size, high complexity and high performance mass manufactured PICs by developing a revolutionary yet CMOS-compatible fabrication platform for seamless co-integration of active plasmonics with photonic and supporting electronic. The CMOS-compatible metals Aluminum, Titanium Nitride and Copper, will be thoroughly investigated ...
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 10

 TERMINÉ 

Enhanced substrates and GaN pilot lines enabling compact power applications (PowerBase)

Date du début: 1 mai 2015, Date de fin: 30 avr. 2018,

The key objective of PowerBase “Enhanced substrates and GaN pilot lines enabling compact power applications” is to ensure the availability of Electronic Components and Systems (ECS) for key markets and for addressing societal challenges, aiming at keeping Europe at the forefront of the technology development, bridging the gap between research and exploitation, creating economic and employment grow ...
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 40

 TERMINÉ 

Excellence in Speed and Reliability for More Than Moore Technologies (ERAMP)

Date du début: 1 avr. 2014, Date de fin: 1 avr. 2017,

Europe’s strengths are based on the deep knowledge and market position in automotive industry, industrial electronics industry and leading know how for More-than-Moore based embedded system. It is of vital interest for the electronics manufacturers in Europe to have fast access to reliable prototypes of electronic devices as well as competitive advanced manufacturing of such devices made in Europe ...
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 26

 TERMINÉ 

Automotive Tested High Voltage and Embedded Non-Volatile Integrated System on Chip platformemploying 3D Integration (ATHENIS_3D)

Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,

...nd magnetic sensors all meeting reliability requirements up to 200C application temperatures have to be mastered for the first time. This will be achieved by combining TSV and HV-CMOS technology from ams with CMOS and Cu-TSV technology from CEA-Leti, MRAM technology from Crocus and WLP technology from Besi. Platform scalability will be proven by flipchip packaging of 14nm CMOS samples on the inte ...
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 11

 TERMINÉ 

Multi-entity-security using active Transmission Technology for improved Handling of Exportable security credentials Without privacy restrictions (MATTHEW)

Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,

...access control system. An ABC-based cryptographic API will provide pseudonyms for privacy.MATTHEW brings together eight highly qualified European partners, world market leading industries (IFAT, GTO, AMS, IFAG), research oriented SMEs (IMA, TEC, CRX) as well as a high esteemed university institute for ICT security (IAIK).
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 8

 TERMINÉ 

Multi-Sensor-Platform for Smart Building Management (MSP)

Date du début: 1 sept. 2013, Date de fin: 31 août 2016,

The concept of the MSP project is based on a multi-project wafer approach that enables the development of highly innovative components and sensors based on Key Enabling Technologies (KETs). The central objective of the MSP-project is the development of a technology and manufacturing platform for the 3D-integration of sophisticated components and sensors with CMOS technology being the sound foundat ...
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 17

 TERMINÉ 

Enhanced Power Pilot Line - EPPL (EPPL)

Date du début: 1 avr. 2013, Date de fin: 31 mars 2016,

A sustainable and competitive European power semiconductor industry is essential to support the megatrend developments formulated in the Europe 2020 strategy - climate change, energy security, food security, and health and aging population. In practically all these areas, power semiconductors play a vital role. Thus, it is of paramount importance to defend and further extend Europe’s leading posit ...
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 33

 TERMINÉ 

ENERGY TO SMART GRID (E2SG)

Date du début: 1 avr. 2012, Date de fin: 1 mars 2015,

The target of the overall E2SG project is to devise and design mechanisms and policies to assemble, monitor and control smart grids, i.e. a set of interconnected nodes whose primary goal is to generate, exchange and consume electrical energy in the most efficient and reliable way by exploiting distributed information that is sensed, transmitted and processed over the same set of nodes and links. F ...
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 32

 TERMINÉ 

Energy Storage with lowered cost and improved Safety and Reliability for electrical vehicles (ESTRELIA)

Date du début: 1 mai 2011, Date de fin: 31 oct. 2014,

High costs together with concerns for driving range, reliability and safety are still the main hindrance for market adaption of full electrical vehicles (FEVs). ESTRELIA aims to provide building blocks with enhanced reliability and safety at lowered costs for smart energy storage for FEVs.This is accomplished by proposing a modular approach with ultracapacitor power packs with higher density with ...
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 9

 TERMINÉ 

Process Oriented Electrical Control Units for Electrical Vehicles Developed on a Multi-system Real-time Embedded Platform (POLLUX)

Date du début: 1 mars 2010, Date de fin: 30 sept. 2013,

"The objective of POLLUX is to develop a distributed real time embedded systems platform for next generation electric vehicles, by using a component and programming-based design methodology. Reference designs and embedded systems architectures for high efficiency innovative mechatronics systems will be addressed with regard to requirements on composability, networking, security, robustness, diagno ...
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 37

 TERMINÉ 

Semiconductor Equipment Assessment Leveraging Innovation (SEAL)

Date du début: 1 juin 2010, Date de fin: 30 sept. 2013,

Description Seal is an EC-funded project covering semiconductor equipment assessment to strengthen the European semiconductor equipment industry. SEAL is an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing equipment. The assessment th ...
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 39

 TERMINÉ 

Efficient Silicon Multi-Chip System-in-Package Integration - Reliability, Failure Analysis and Test (ESIP)

Date du début: 1 mai 2010, Date de fin: 1 avr. 2013,

The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) solutions. Highly integrated systems with greater miniaturisation and increased functionality open new markets and improve the quality of life through a wide range of applications. In particular, higher systems integration technologies using multi-chip packaging, th ...
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 40

 TERMINÉ 

Central Nervous System Imaging (CSI)

Date du début: 1 mars 2010, Date de fin: 1 févr. 2013,

Diseases affecting the brain and the central nervous system are among those with the greatest impact on our society. The ENIAC JU project CSI aims to advance the state of the art in three-dimensional (3D) medical-imaging platforms to improve the efficiency of the diagnosis and therapy of these serious diseases. The objective of the project is to develop an innovative yet simple and low-cost smart ...
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 15

 TERMINÉ 

pHotonics ELectronics functional Integration on CMOS (HELIOS)

Date du début: 1 mai 2008, Date de fin: 30 nov. 2012,

Photonics on CMOS is a candidate technology for applications where functional integration is needed for improving system performance while reducing size and cost.Functional demonstration of basic building blocks such as a µlaser, a detector, coupling, and link has been realized in previous research projects. As a next step the HELIOS project proposes to integrate photonics components with integrat ...
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 22

 TERMINÉ 

COmpact MOdelling Network (COMON) (COMON)

Date du début: 1 déc. 2008, Date de fin: 30 nov. 2012,

"The goal of our Network is to address the full development chain of Compact Modeling (CM) of advanced CMOS and III-V technologies, from the technology level to the system level. Our mission is driven by the need to enhance scientific knowledge, transfer scientific and technological knowledge from academia to industry, to strengthen the European integrated circuit (IC) industry with powerful desi ...
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 16

 TERMINÉ 

E3Car -> Nanoelectronics for an energy efficient electrical car (E3CAR)

Date du début: 1 févr. 2009, Date de fin: 1 janv. 2012,

The objective of the project is the development of nanoelectronics technologies, devices, circuits architectures and modules for electrical cars/vehicles and demonstration of these modules in a final systems.Emissions from road vehicles have to be reduced substantially in the future. The ultimate goal of most car manufacturers is to get to a completely electric vehicle, protecting the environment ...
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 32