5 projets européens trouvés
Recherche sur 125080 projets européens
TERMINÉ
RADiation and reliability challenges for electronics used in Space, Avionics, on the Ground and at Accelerators (RADSAGA)
Date du début: 1 mars 2017, Date de fin: 28 févr. 2021,
Reliability and radiation damage issues have a long and important history in the domain of satellites and space missions. Qualification standards were established and expertise was built up in space agencies (ESA), supporting institutes and organizations (CNES, DLR, etc.) as well as universities and specialized companies. During recent years, radiation concerns are gaining attention also in aviati ...
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9
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TERMINÉ
MANpower - Energy Harvesting and Storage for Low Frequency Vibrations (MANpower)
Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,
Energy harvesting at low frequency has proven to be difficult to achieve in the past because of the properties of the materials that the devices are fabricated from. In particular the stiffness of conventional silicon and all piezoelectric materials makes it exceedingly difficult to make a system that can operate below 100Hz. There are many sources of low frequency vibrations e.g. human motion, th ...
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9
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TERMINÉ
Best-Reliable Ambient Intelligent Nano Sensor Systems (e-BRAINS)
Date du début: 1 sept. 2010, Date de fin: 28 févr. 2014,
...ficantly higher integration densities. Performance, multi-functionality and reliability of such complex heterogeneous systems will be limited mainly by the wiring between the subsystems. Suitable 3D integration technologies create a basis to overcome these drawbacks with the benefit of enabling minimal interconnection lengths. In addition to enabling high integration densities, 3D integration is a ...
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20
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TERMINÉ
Efficient and Precise 3D Integration of Heterogeneous Microsystems from Fabrication to Assembly (FAB2ASM)
Date du début: 1 mai 2010, Date de fin: 30 avr. 2013,
FAB2ASM tackles a major problem in 3D integration that currently limits industrial take-up: high throughput and high accuracy 3D integration of miniaturized dies onto dies or substrates. This issue is extremely important for 3D integration of microelectronics and microsystems. 3D integration will take off in the next 5 years in all measures including total number of devices, the market share, as w ...
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10
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TERMINÉ
Efficient Silicon Multi-Chip System-in-Package Integration - Reliability, Failure Analysis and Test (ESIP)
Date du début: 1 mai 2010, Date de fin: 1 avr. 2013,
The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) solutions. Highly integrated systems with greater miniaturisation and increased functionality open new markets and improve the quality of life through a wide range of applications. In particular, higher systems integration technologies using multi-chip packaging, th ...
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