EC - Horizon 2020 logo

High density Electrical connectors - JTI-CS2-2017-CFP06-LPA-03-12
Date de clôture : 21 juin 2017  

 Technologie aérospatiale
 Électronique et microélectronique
 Industries aéronautiques

Specific Challenge:

The topic aims at defining new type of connectors addressing Modular, low cost and high density connection for avionics application. These new connectors will be designed, manufactured and tested onto a Remote Data Power Cabined studied in the frame of the Platform 3 of LPA IADP. The applicant will benefit of this topic to prepare a future standard of connectors. Please refer to the full and formal topic descriptions published in this call.

Lien officiel :   Disponible pour les utilisateurs enregistrés