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4 projets européens trouvés

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 TERMINÉ 

Extended Large (3D) Integration TEchnology (ELITE)

Date du début: 1 nov. 2007, Date de fin: 31 août 2011,

Description 3-D integration in high performance digital systems For developing complex next-generation chips which include a combination of disparate technologies, the circuit integration exclusively in two dimensions has proved to be a seriously limiting factor. Utilising the third dimension for ...
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 6

 TERMINÉ 

Gigascale Oriented Solid State flAsh Memory for EuRope (GOSSAMER)

Date du début: 1 janv. 2008, Date de fin: 30 juin 2011,

Description GOSSAMER successfully developed a fully integrated Flash NAND technology based on the TANOS concept, investigating a large number of architecture and material options. The project aimed at the development of the technology for very high density Non Volatile Memories for mass storage ap ...
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 21

 TERMINÉ 
NANOSIL Network of Excellence aims to integrate at the European level the excellent European research laboratories and capabilities in order to strengthen scientific and technological excellence in the field of nanoelectronic materials and devices for terascale integrated circuits (ICs) and disseminate the results in a wide scientific and industrial community.NANOSIL will explore and assess the sc ...
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 38

 TERMINÉ 

MAsk less lithoGraphy for IC manufacturing (MAGIC) (MAGIC)

Date du début: 1 janv. 2008, Date de fin: 31 déc. 2010,

Description MAGIC has supported the development of e-beam based maskless lithography technology in Europe: Two parallel lithography tool developments for 32nm CMOS and beyond and on lithography infrastructure.In the CMOS manufacturing environment, the mask-based optical lithography technique is up to now driving solution to deal with all ...
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 19