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Nano Packaging Technology for Interconnect and Heat Dissipation (NANOPACK)

Date du début: 1 nov. 2007, Date de fin: 30 sept. 2011,

One of the major limitations to continued performance increases in the semiconductor and power electronics industries is integration density and thermal management. Continued transistor downscaling is quickly reaching its limits forcing a new focus on heterogeneous integration and 3D packaging technologies to continue performance improvements by reducing interconnect length between memory and mult ...
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