3 projets européens trouvés
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TERMINÉ
Support Action for 450mm topics establishing a Bridge between European EM entities and IDMs, Foundries and Entities Worldwide (Bridge450)
Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,
Five major global semiconductor companies are working in the G450C consortium based in Albany N.Y. to introduce 450mm wafer semiconductor processing and are now installing the first wave of 450mm prototype systems. Intel and TSMC lead this effort with published roadmaps showing pilot lines in 2016, production in 2018. Samsung will soon follow which will force GlobalFoundries, SK Hynix, Toshiba, UM ...
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12
Participants partenaires
TERMINÉ
Coordination Action to enable an effective European 450 mm Equipment & Materials Network (ENABLE450)
Date du début: 1 nov. 2012, Date de fin: 31 oct. 2016,
5 major global semiconductor companies Intel, Samsung, TSMC, IBM and Global Foundries, have decided to work closely together to bring 450 mm semiconductor processing to a mature level, within a consortium called G450C. This operation, based in Albany N.Y., is currently ordering and installing the first wave of 450 mm systems. The major drivers of this effort are Intel and TSMC, which have provide ...
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13
Participants partenaires
TERMINÉ
Gigascale Oriented Solid State flAsh Memory for EuRope (GOSSAMER)
Date du début: 1 janv. 2008, Date de fin: 30 juin 2011,
Description
GOSSAMER successfully developed a fully integrated Flash NAND technology based on the TANOS concept, investigating a large number of architecture and material options.
The project aimed at the development of the technology for very high density Non Volatile Memories for mass storage ap ...
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