Date du début: 1 janv. 2017,
Date de fin: 31 déc. 2020,
Silicon carbide presents a high breakdown field (2-4 MV/cm) and a high energy band gap (2.3–3.2 eV), largely higher than for silicon. Within this frame, the cubic polytype of SiC (3C-SiC) is the only one that can be grown on a host substrate with the huge opportunity to grow only the silicon carbide thickness required for the targeted application. The possible growth on silicon substrate has remai ...
Date du début: 1 avr. 2016,
Date de fin: 31 mars 2020,
The vision of 1D-NEON proposal is to develop fibre-based smart materials along with an integrated technology platform for the manufacturing in Europe of new products with multi-sectorial applications in consumer electronics, energy, healthcare and fitness, smart buildings, sensors and e-skin for soft robotics.The overall objective of 1D-NEON is to build a modular platform for manufacturing fibre-b ...
Date du début: 1 juil. 2015,
Date de fin: 30 juin 2019,
EXTMOS’ main objective is to create a materials model and the related user friendly code that will focus on charge transport in doped organic semiconductors. Its aims are (i) to reduce the time to market of(a) multilayer organic light emitting devices, OLEDs, with predictable efficiencies and long lifetimes (b) organic thin film transistors and circuits with fast operation.(ii) to reduce productio ...
Date du début: 1 déc. 2014,
Date de fin: 30 nov. 2018,
Our project aims to fill the gap between flexible electronic technology and design by developing highly predictive, generic, open-source, design-oriented organic and oxide based TFT compact model libraries, to be integrated in commercial Electron Design Automation (EDA) environments for full large area low cost circuit design for novel applications. These model libraries will be released together ...
Date du début: 1 juin 2015,
Date de fin: 31 mai 2018,
Heat management is a paramount challenge in many cutting edge technologies, including new GaN electronic technology, turbine thermal coatings, resistive memories, or thermoelectrics. Further progress requires the help of accurate modeling tools that can predict the performance of new complex materials integrated in these increasingly demanding novel devices. However, there is currently no general ...
Date du début: 1 avr. 2012,
Date de fin: 1 mars 2015,
The target of the overall E2SG project is to devise and design mechanisms and policies to assemble, monitor and control smart grids, i.e. a set of interconnected nodes whose primary goal is to generate, exchange and consume electrical energy in the most efficient and reliable way by exploiting distributed information that is sensed, transmitted and processed over the same set of nodes and links. F ...
Date du début: 1 mars 2011,
Date de fin: 1 juin 2014,
Integration of heterogeneous systems in a package (SiP) allows smaller, smarter and more energy efficient products for many applications. Through SiPs, even small or medium-sized enterprises could gain access to the development of technologically advanced, miniaturized products. However, to date, the lack of appropriate design methodologies and flows hinders the efficient development of SiPs. PARS ...
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