7 projets européens trouvés
Recherche sur 125080 projets européens
TERMINÉ
Rf Engineered substrates to FostER fEm performaNCE (REFERENCE)
Date du début: 1 déc. 2015, Date de fin: 31 mai 2019,
The REFERENCE project aims to leverage a European leading edge Radio Frequency (RF) ecosystem based on RF Silicon On Insulator (SOI) disruptive technology, perceived as the most promising to address performance, cost and integration needs for RF Front End Modules (FEMs)s.The project targets to develop over the next 3 years, innovative solutions from material, engineered substrates, process, design ...
Voir le projet
18
Participants partenaires
TERMINÉ
Enhanced substrates and GaN pilot lines enabling compact power applications (PowerBase)
Date du début: 1 mai 2015, Date de fin: 30 avr. 2018,
The key objective of PowerBase “Enhanced substrates and GaN pilot lines enabling compact power applications” is to ensure the availability of Electronic Components and Systems (ECS) for key markets and for addressing societal challenges, aiming at keeping Europe at the forefront of the technology development, bridging the gap between research and exploitation, creating economic and employment grow ...
Voir le projet
40
Participants partenaires
TERMINÉ
Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologies (WAYTOGO FAST)
Date du début: 1 mai 2015, Date de fin: 30 avr. 2017,
The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (FDSOI) so as to compete in leading edge technology at node 14nm and beyond preparing as well the following node transistor architecture. Europe is at the root of this breakthrough technology in More Moore law. The project aims at establishing a distributed pilo ...
Voir le projet
32
Participants partenaires
TERMINÉ
European E&M 450mm Pilotline Readiness (EEM450PR)
Date du début: 1 avr. 2012, Date de fin: 1 mars 2015,
Aim of the EEM450PR project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative. It will also bring about the start of a vision to place an equipment development pilot line in the imec facility in Leuven. This will provide Europe with a complementary activity for 450mm equi ...
Voir le projet
32
Participants partenaires
TERMINÉ
Enable power technologies on 300mm wafer diameter (EPT300)
Date du début: 1 avr. 2012, Date de fin: 1 mars 2015,
EPT 300 aims to be a decisive step forward to strengthen Europe’s leading position in power semiconductor technologies and More-than-Moore manufacturing capabilities relating to energy efficient electronic solutions. Power semiconductor devices fabricated in a European leading pilot line for 300mm wafer production are the scope of the project, for which manufacturing excellence, cost competitivene ...
Voir le projet
22
Participants partenaires
TERMINÉ
Semiconductor Equipment Assessment Leveraging Innovation (SEAL)
Date du début: 1 juin 2010, Date de fin: 30 sept. 2013,
Description
Seal is an EC-funded project covering semiconductor equipment assessment to strengthen the European semiconductor equipment industry.
SEAL is an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing equipment. The assessment th ...
Voir le projet
39
Participants partenaires
TERMINÉ
European 450mm Equipment & Materials Initiative (EEMI 450)
Date du début: 1 avr. 2010, Date de fin: 1 mars 2013,
Large-scale semiconductor fabrication is now standardised on 300mm diameter wafers. However, as demand grows and node dimensions diminish, major chipmakers are considering offsetting the growing costs of miniaturisation by increasing wafer size to 450mm to cut cost per produced die. A prerequisite is the availability of the required quality wafers and equipment able to handle larger wafers. The EN ...
Voir le projet