2 projets européens trouvés
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TERMINÉ
3 Dimensional Light sEnsing for Advanced Portable Devices (3D-LEAP)
Date du début: 1 juil. 2015, Date de fin: 30 juin 2017,
This proposal aims to develop 3 Dimensional Mini-cameras (producing 3D-Images) for mobile phones, tablets and laptop computers; more specifically embedded camera modules providing 2D and 3D-Images, integrating sensing electronics and optics in a single lens Wafer Level Camera (WLC).This market creating innovative device is aiming towards disruptive market-share and global leadership in 3D-imaging ...
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TERMINÉ
3 Dimensional Light Sensor for Advanced Portable Devices (3D-LEAP)
Date du début: 1 oct. 2014, Date de fin: 31 déc. 2014,
This proposal aims to develop miniaturized 3 Dimensional (3D) cameras for mobile phones, tablets and laptop computers; more specifically embedded camera modules providing 2D and 3D-Images, integrating image-sensing electronics and light-field optics in a single lens Wafer Level Camera (WLC).This disruptive device is aiming towards significant market-shares and global leadership in 3D-imaging camer ...
Voir le projet