6 projets européens trouvés
Recherche sur 125080 projets européens
TERMINÉ
3D Advanced Metrology and materials for advanced devices (3DAM)
Date du début: 1 avr. 2016, Date de fin: 31 mars 2019,
... to their limits.3DAM will be a path-finding project which supports and complements several existing and future ECSEL pilot-line projects and is linked to the MASP area 7.1 (subsection More Moore). Innovative demonstrators and methodologies will be built and evaluated within the themes of metrology and characterization of 3D device architectures and new materials, across the full IC manufacturing ...
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18
Participants partenaires
TERMINÉ
Technology Advances and Key Enablers for 5 nm (TAKE5)
Date du début: 1 avr. 2016, Date de fin: 31 mars 2019,
...e. The main objective of the TAKE5 project is the demonstration of 5nm patterning in line with the industry needs and the ITRS roadmap in the Advanced Patterning Center at the imec pilot line using innovative design and technology co-optimization, layout and device architecture exploration, and comprising demonstration of a lithographic platform for EUV technology, advanced process and holistic me ...
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13
Participants partenaires
TERMINÉ
Seven Nanometer Technology (SeNaTe)
Date du début: 1 avr. 2015, Date de fin: 31 mars 2018,
...es. The main objective is the demonstration of the 7nm IC technology integration in line with the industry needs and the ITRS roadmap on real devices in the Advanced Patterning Center at imec using innovative device architecture and comprising demonstration of a lithographic platform for EUV and immersion technology, advanced process and holistic metrology platforms, new materials and mask infrast ...
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41
Participants partenaires
TERMINÉ
Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologies (WAYTOGO FAST)
Date du début: 1 mai 2015, Date de fin: 30 avr. 2017,
The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (FDSOI) so as to compete in leading edge technology at node 14nm and beyond preparing as well the following node transistor architecture. Europe is at the root of this breakthrough technology in More Moore law. The project aims at establishing a distributed pilo ...
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32
Participants partenaires
TERMINÉ
European 450mm Equipment Demo Line (E450EDL)
Date du début: 1 oct. 2013, Date de fin: 30 sept. 2016,
The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative and proceeded with subsequent projects funded with public money, amongst others NGC450, SOI450, EEM450PR. The demo line resulting from this project will be such that it will enable first crit ...
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44
Participants partenaires
TERMINÉ
European E&M 450mm Pilotline Readiness (EEM450PR)
Date du début: 1 avr. 2012, Date de fin: 1 mars 2015,
Aim of the EEM450PR project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative. It will also bring about the start of a vision to place an equipment development pilot line in the imec facility in Leuven. This will provide Europe with a complementary activity for 450mm equi ...
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