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 TERMINÉ 

MASKLESS ELECTROCHEMICAL SURFACE MODIFICATION PROCESS (MESMOPROC)

Date du début: 5 août 2012, Date de fin: 4 août 2015,

The central project aims are to:Implement a novel low cost, resource efficient and sustainable process by combining electrochemical reactor engineering with innovative ultrasound agitation to enable selective metallisation of microscale devices, components and printed circuit boards (PCBs) without requiring photolithography.Design, integrate and scale-up the technology to enable successful, econom ...
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 TERMINÉ 

Advanced Surface Protection for Improved Reliability PCB Systems (ASPIS)

Date du début: 1 oct. 2010, Date de fin: 30 sept. 2013,

"To investigate the scope, extent and factors causing black pad and related problems on printed circuit boards with an electroless nickel / immersion gold (ENIG) solderable finish . To develop a non-destructive test method to show the presence of black pad. To develop and test lower cost, less aggressive surface protection chemistries as replacements for conventional ENIG using both aqueous and io ...
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