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 TERMINÉ 
The European lighting industry aims at reducing cost, at continuously improving product performance while reducing time to market and enlarging the product. The main challenge for the design in of LED components into lighting systems is the temperature and current dependence of their performance. In order to achieve a good design of LED systems, a modular, multi-physics based modelling approach is ...
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 15

 TERMINÉ 

Nano Packaging Technology for Interconnect and Heat Dissipation (NANOPACK)

Date du début: 1 nov. 2007, Date de fin: 30 sept. 2011,

One of the major limitations to continued performance increases in the semiconductor and power electronics industries is integration density and thermal management. Continued transistor downscaling is quickly reaching its limits forcing a new focus on heterogeneous integration and 3D packaging technologies to continue performance improvements by reducing interconnect length between memory and mult ...
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 17

 TERMINÉ 
Advanced automotive functions are increasingly dependent on software and electronics. The complexity and criticality of automotive embedded systems already constitute an inhibiting factor for further evolution of functionality. This is evident for single automotive systems and even more so for functions that interact between vehicles and between vehicle and infrastructure, cooperative systems. New ...
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