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Functional joining of dissimilar materials using directed self-assembly of nanoparticles by capillary-bridging (HYPERCONNECT)
Date du début: 1 janv. 2013, Date de fin: 31 déc. 2015,
Tomorrows micro-electronic devices will have to show more functionality and performance at smaller form factor, lower cost and lower energy consumption in order to be competitive on this multi-billion dollar market. Advanced system integration is thus inevitable, a trend bound to joining dissimilar materials with new packaging technologies. These processes must enable lower thermal resistances and ...
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