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Modular interposer architecture providing scalable heat removal, power delivery, and communication (CarrICool)
Date du début: 1 janv. 2014, Date de fin: 31 déc. 2016,
Modular interposer architecture providing scalable heat removal, power delivery and communicationCarrICool will deliver a game-changing 3D packaging platform for scale-up of future, many-core, Exascale computing systems. The project will also develop a strategic supplier base in Europe for high-end HPC components and systems integration capabilities in the Exascale era. In CarrICool, advanced More ...
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