7 projets européens trouvés
Recherche sur 125080 projets européens
TERMINÉ
Technology Advances and Key Enablers for 5 nm (TAKE5)
Date du début: 1 avr. 2016, Date de fin: 31 mars 2019,
The TAKE5 project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm development for the 10nm technology node and the ECSEL JU project SeNaTe aiming at the 7nm technology node. The main objective of the TAKE5 project is the demonstration of 5nm patterning in line with the industry needs and the ITRS roadmap in the Advanced Patter ...
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13
Participants partenaires
TERMINÉ
Seven Nanometer Technology (SeNaTe)
Date du début: 1 avr. 2015, Date de fin: 31 mars 2018,
The SeNaTe project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm development for the 12nm and 10nm technology nodes. The main objective is the demonstration of the 7nm IC technology integration in line with the industry needs and the ITRS roadmap on real devices in the Advanced Patterning Center at imec using innovative devi ...
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41
Participants partenaires
TERMINÉ
European 450mm Equipment Demo Line (E450EDL)
Date du début: 1 oct. 2013, Date de fin: 30 sept. 2016,
The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative and proceeded with subsequent projects funded with public money, amongst others NGC450, SOI450, EEM450PR. The demo line resulting from this project will be such that it will enable first crit ...
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44
Participants partenaires
TERMINÉ
European E&M 450mm Pilotline Readiness (EEM450PR)
Date du début: 1 avr. 2012, Date de fin: 1 mars 2015,
Aim of the EEM450PR project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative. It will also bring about the start of a vision to place an equipment development pilot line in the imec facility in Leuven. This will provide Europe with a complementary activity for 450mm equi ...
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32
Participants partenaires
TERMINÉ
Semiconductor Equipment Assessment Leveraging Innovation (SEAL)
Date du début: 1 juin 2010, Date de fin: 30 sept. 2013,
Description
Seal is an EC-funded project covering semiconductor equipment assessment to strengthen the European semiconductor equipment industry.
SEAL is an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing equipment. The assessment th ...
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39
Participants partenaires
TERMINÉ
Micromirror enhanced micro-imaging (MEMI)
Date du début: 1 janv. 2008, Date de fin: 30 juin 2011,
An essential part of high-end optical microscopes is the ability to control various apertures and stops in both the illumination and imaging paths of these microscopes, in order to maximize the visualization of the objects under observation. Traditionally, these controls are implemented by mechanical apertures, irises and pinholes in such applications as coherence control, darkfield microscopy an ...
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5
Participants partenaires
TERMINÉ
MAsk less lithoGraphy for IC manufacturing (MAGIC) (MAGIC)
Date du début: 1 janv. 2008, Date de fin: 31 déc. 2010,
Description
MAGIC has supported the development of e-beam based maskless lithography technology in Europe: Two parallel lithography tool developments for 32nm CMOS and beyond and on lithography infrastructure.In the CMOS manufacturing environment, the mask-based optical lithography technique is up to now driving solution to deal with all ...
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