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 TERMINÉ 

Multispectal terahertz, infrared, visible imaging and spectroscopy (MUTIVIS)

Date du début: 1 mai 2008, Date de fin: 30 juin 2012,

Components for multi spectral, real-time, room-temperature operating imaging and spectroscopy for multiple application fields as security technology, transport, production technology, or health and life-science are proposed. The first objective of the project is the development of a multi spectral imaging sensor working in the visible, long wave infrared, and terahertz band of the electromagnetic ...
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 6

 TERMINÉ 

Nano Packaging Technology for Interconnect and Heat Dissipation (NANOPACK)

Date du début: 1 nov. 2007, Date de fin: 30 sept. 2011,

One of the major limitations to continued performance increases in the semiconductor and power electronics industries is integration density and thermal management. Continued transistor downscaling is quickly reaching its limits forcing a new focus on heterogeneous integration and 3D packaging technologies to continue performance improvements by reducing interconnect length between memory and mult ...
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