11 projets européens trouvés
Recherche sur 125080 projets européens
TERMINÉ
Rf Engineered substrates to FostER fEm performaNCE (REFERENCE)
Date du début: 1 déc. 2015, Date de fin: 31 mai 2019,
The REFERENCE project aims to leverage a European leading edge Radio Frequency (RF) ecosystem based on RF Silicon On Insulator (SOI) disruptive technology, perceived as the most promising to address performance, cost and integration needs for RF Front End Modules (FEMs)s.The project targets to develop over the next 3 years, innovative solutions from material, engineered substrates, process, design ...
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18
Participants partenaires
TERMINÉ
Ultra-Low PoweR technologIes and MEmory architectures for IoT (PRIME)
Date du début: 1 déc. 2015, Date de fin: 31 mars 2019,
The goal of the PRIME project is to establish an open Ultra Low Power (ULP) Technology Platform containing all necessary design and architecture blocks and components which could enable the European industry to increase and strengthen their competitive and leading eco-system and benefit from market opportunities created by the Internet of Things (IoT) revolution. Over 3 years the project will deve ...
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19
Participants partenaires
TERMINÉ
THINGS2DO (THINGS2D0)
Date du début: 1 janv. 2014, Date de fin: 1 janv. 2018,
Develop the FDSOI ecosystem in Europe, beyond the PLACES2BE Pilot Line, in order to increase the impact of this European technology. At the time of set up of the first KET pilot line the proof of FDSOI was mainly technological. In between then and now, the first realization of a complex silicon chip in FDSOI has shown to the worldwide microelectronics community the capabilities of this technology. ...
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44
Participants partenaires
TERMINÉ
Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologies (WAYTOGO FAST)
Date du début: 1 mai 2015, Date de fin: 30 avr. 2017,
The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (FDSOI) so as to compete in leading edge technology at node 14nm and beyond preparing as well the following node transistor architecture. Europe is at the root of this breakthrough technology in More Moore law. The project aims at establishing a distributed pilo ...
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32
Participants partenaires
TERMINÉ
Technology CAD for III-V Semiconductor-based MOSFETs (III-V-MOS)
Date du début: 1 nov. 2013, Date de fin: 30 avr. 2017,
...of atomistic simulations for technology development (QuantumWise); by a research center (IMEC) and an industry lab (IBM) engaged in CMOS fabrication technology development and by the European foundry GLOBALFOUNDRIES Dresden.
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11
Participants partenaires
TERMINÉ
Semiconductor Equipment Assessment for Key Enabling Technologies (SEA4KET)
Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,
SEA4KET (Semiconductor Equipment Assessment for Key Enabling Technologies) is an IP proposal taking the consequent step from equipment R&D to equipment assessment experiments. The strategic objective is to effectively combine resources and expertise in a joint assessment of novel equipment for key enabling technologies to foster and accelerate the successful transfer of novel European equipment in ...
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26
Participants partenaires
TERMINÉ
Pilot Lines for Advanced CMOS EmbodimentS in 2x nodes, Built in Europe (PLACES2BE)
Date du début: 3 déc. 2012, Date de fin: 31 déc. 2015,
...ribute to the cluster policy that is an integral part of the Horizon 2020 strategy.Consortium: PLACES2BE Pilot line gathers 27 experienced partners, including industry leaders such as GLOBALFOUNDRIES, ARM, STEricsson, SOITEC, MENTOR Graphics along the microelectronics value chain, SMEs such as Open Engineering, eSilicon, GSS, Axiom, IBS, RTOs such as the Fraunhoger Gesellschaft, IMEC, and LETI, an ...
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22
Participants partenaires
TERMINÉ
Integrated Solutions for Agile Manufacturing in High-mix Semiconductor Fabs (INTEGRATE)
Date du début: 1 janv. 2013, Date de fin: 31 déc. 2015,
European IC manufacturers are on the way to become suppliers of customized products for OEM companies, which means high flexibility and product diversity. The project aims at conducting research to support the development of new manufacturing procedures, new organizations and new information and control tools to enable IC production lines to efficiently manage a high product and technology mix and ...
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29
Participants partenaires
TERMINÉ
Steep subthreshold slope switches\nfor energy efficient electronics (STEEPER)
Date du début: 1 juin 2010, Date de fin: 30 nov. 2013,
Description
European Union Research Initiative Aims to Increase
Electronic Device Efficiency by 10x and Eliminate Power Consumption of Devices in Standby Mode
STEEPER addresses the development of Beyond CMOS energy-efficient steep subthreshold slope transistors based on quantum mechanical band-to ...
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14
Participants partenaires
TERMINÉ
Semiconductor Equipment Assessment Leveraging Innovation (SEAL)
Date du début: 1 juin 2010, Date de fin: 30 sept. 2013,
Description
Seal is an EC-funded project covering semiconductor equipment assessment to strengthen the European semiconductor equipment industry.
SEAL is an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing equipment. The assessment th ...
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39
Participants partenaires
TERMINÉ
MAsk less lithoGraphy for IC manufacturing (MAGIC) (MAGIC)
Date du début: 1 janv. 2008, Date de fin: 31 déc. 2010,
Description
MAGIC has supported the development of e-beam based maskless lithography technology in Europe: Two parallel lithography tool developments for 32nm CMOS and beyond and on lithography infrastructure.In the CMOS manufacturing environment, the mask-based optical lithography technique is up to now driving solution to deal with all ...
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