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Support Action for 450mm topics establishing a Bridge between European EM entities and IDMs, Foundries and Entities Worldwide (Bridge450)
Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,
Five major global semiconductor companies are working in the G450C consortium based in Albany N.Y. to introduce 450mm wafer semiconductor processing and are now installing the first wave of 450mm prototype systems. Intel and TSMC lead this effort with published roadmaps showing pilot lines in 2016, production in 2018. Samsung will soon follow which will force GlobalFoundries, SK Hynix, Toshiba, UM ...
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